Magnetron Sputtering Vacuum Metallizing Machine (Vertical Type) Products > Magnetron Sputtering Vacuum Metallizing Machine (Vertical Type)

Magnetron Sputtering Vacuum Metallizing Machine (Vertical Type)

Magnetron sputtering vacuum metalizing & coating machine(box type) , mainly applied for sputtering metal, non-metal material and alloy material. equips molecule pump to ensure the best performance and best non-oil vacuum area for metalizing, the clamp adop Revolution and Rotation two types to ensure biggest place under sputtering and uniformoty. this mahine its coating layer tightless is best in industry. many reseraching Base and univercity select this machine to execute high precision components, also used for all kind of hardware or decrative things like bangles.
Click to enlarge


Regarding to the structure, magnetron sputtering coating machine (vacuum metallizer) is divided into lift-down type and box type. Box-type magnetron sputtering coating machine (vacuum metallizing equipment) adopts Renovation and rotation two types to guarantee uniformity of the substrate. The basic distance of target is adjustable. The configuration is equipped with the molecular pump system (Diffusion pump and condensate pump system is selectable).


magnetron sputtering vacuum coating machine(box type) is widely used for aerospace industry, researching base, univercity and company reseraching for higher precision components, also sor decorative pieces of plastic like bangles, metal pieces (watches, mobile phone sasing, sanitary ware, car wheels, ect), glass or plastic lenses, tools, dies and other fields. Vacuum metallizer is mainly used for sputtering metal, non-metallic material or alloy materials.


1. The adhesion of film layer is stronger.
2. The density of film layer is superior.
3. The repeatability of film layer is superior.


Model JS400-X/3 JS500-X/3 JS600-X/4
Vacuum Chamber The dimension of the vacuum chamber is confirmed according to the configuration. It uses stainless steel material (including vacuum pipe)
Ultimate Vacuum 2 × 10-4 Pa
Recovery Vacuum 5.5 × 10-3<16 min
Vacuum System Direct connection pump/mechanical pump+ molecular pump/condensate pump
Way of Sputtering Sputtering from top to bottom/from bottom to top/from the side
Shape of Target Round shape target/Rectangular target
Power of Sputtering DC power+ RF power
Way of Baking iodine-wolfram lamp or tubular heater
Baking Temperature Normal 300℃, controllable and adjustable
Ion Bombardment 0 to 3kv,0 to 200mA
Work Piece Fixture Cylindrical/multi-lateral shape, revolution and rotation fixture, planetary , work piece holder, etc